SND-N is a manual printing tool for BGA and CSP. It must be made of the metal mask, to the BGA. However,
SND-N can be using for any kinds of the metal-mask.
If solder paste is inserted in the slot of SND-N for transcription and set up it to MS9000SAN-III. even transcription of solder paste is possible.
SND-N Printing Tool
The BGA after printing is supply to the nozzle of the rework machine. The center bit of the nozzle will be pick the BGA up from SND-N directly.
In SND-N, any printing has components at the center of the nozzle.
As for it, transcription printing, the nozzle is already equipped with BGA.
|SND-N Tool Size||80 x 170 x 10tmm|
|Metal-Mask||50 x 80mm|
|Thickness of the mask||0.1 -- 0.15mm t|
|Solder Transription Slot||150 and 200 micron of depth|
|Squeegee||for Max 40mm BGA x 1|
The specification are subject to change without notice.
The metal mask for SND-N is required for every kind of BGA. Therefore, please manufacturing on the drawing of a metal mask.
The Vacuum bit (Pickup Pin) is prepared for every size of a chip component.It is for pickup of a chip from the taping parts reliably. Taping parts shall be 100 mm in length, and are set. And a tape is fixed to an adhesion slot. Probably, they should be exchanged timely, though an adhesion slot has long durability.
(Adhesive tape is heat-resistant polyimide films currently used also at the newest reflow system. )
There is a metal mask for every chip size. If a metal mask is put according to a guide pin, a suitable amount of solder paste can be supplied.
If even a positioning is completed by the function of the vision of equipment, after that, a pickup and printing are automatic respectively.