SMD Rework Solution

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Home(Products)  >  MS7600 Specifications

MS7600 Micro Device Rework System



Specifications


Item Specifications
Board Size up to 200x250mm
Components Size 0402 to 25 x 25mm CSP
Components Gap 130μmm or more
Top Space up to 25mm
Bottom Space up to 25mm
XY Table Fine Adjust +&- 5.0mm max.
Moving Range 150x200mm max.
Board Holder Z Slot or Holder Jig
Board Support Under side 4 pins by 2 rails
Unit Station (6 units)

1: Remove 0402 / 2: Cleaner / 3: Dispensor /

4: Mount / 5: 0402 Soldering / 6: CSP Rework

Top Heater for 0402 230VA x 1 Hot Air
Top Heater for CSP 230VA x 2 Hot Air
Top Pre-Heater 800VA IR with 8Ф Non-Contact Control Sensor
Bottom Heater 1000VA IR (150 x 320mm) 8Ф Non-Contact C/S
Temperature Controller TFT Coler 10.4 inch Touched Panel
Auto Control System by ITTS auto mode with PID
Maunual Control 0402: 2 zoons / CSP: 6 zoons with PID
Monitor LCD Monitor 22 inch
Vision Camera AF Auto Zoom 72X CCD
External Camera MF Auto Zoom 80X CCD
Data File (CSV) 0402: 50 files / CSP: A:100 / M:100 Files
N2 gas N2 Generator 10L/min.
Air Flow 0402: 0~10L/min
CSP: 20 ~ 40L/min
Power AC200 ~ 240V 2P 3KVA
Dimension 670W x 700D x 770Hmm
Weight 90Kg approx.
Interlock Emargency / Over heat / Over road / Heater trouble etc.

The specification are subject to change without notice.


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M.S.Engineering Co.,Ltd.
1-38-15, Okusawa, Setagaya-Ku, Tokyo, 158-0083 Japan.  Phone: +81-3-4283-3951 Fax: +81-3-3728-5232
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