SMD Rework Solution

We are specialist for SMD Rework such as 0402 chip, CSP,BGA and QFP etc.

MS9000SAN-III:

Rework Station:

Accessories:

Related Systems:

Home(Products) > MS9000SAN-III Options

MS9000SAN-III Rework Station

Options

1. Re flow Nozzle: It choose according to the size.

2. Wide Bottom Heater: It must be equippped by us.

3. Tweezers Nozzle. For Chip size parts reworking.

4. Sensor Kit: it consisted of 5 sensors with Lead wire.

5. Test Board Kit: It is for calibration for vision system.

6. Solder Printing Tool: Model SND-N (Transcriber type)

7. Re-balling Tool: Manual re-balling Jig.

8. PCB Prevention Jig: for preventing warp of the board.

9. BGA Scope: Visual check of the BGA ball.

10. X Ray Inspection System: soldering check

11. RBC-1 Reballing and printing Tool reballing & printing

Nozzles

Tweezers Nozzle

MSX500 X Ray Inspection System ST50K Sensor Kit

OP-TB01 Test Board Kit

Board prevention Jig

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M.S.Engineering Co.,Ltd.
2-17-11, Shinyokohama Kohoku-ku Yokohama-shi, Kanagawa-ken 222-0033 Japan. Phone: +81-45-472-6441 / Fax: +81-45-472-6432
Copyright(C)2007 M.S.Engineering Co.,Ltd. All rights Reserved.

1. Re flow Nozzle: It choose according to the size. 2. Wide Bottom Heater: It must be equippped by us. 3. Tweezers Nozzle. For Chip size parts reworking. 4. Sensor Kit: it consisted of 5 sensors with Lead wire. 5. Test Board Kit: It is for calibration for vision system. 6. Solder Printing Tool: Model SND-N (Transcriber type) 7. Re-balling Tool: Manual re-balling Jig. 8. PCB Prevention Jig: for preventing warp of the board. 9. BGA Scope: Visual check of the BGA ball. 10. X Ray Inspection System: soldering check 11. RBC-1 Reballing and printing Tool reballing & printing
	Nozzles

	Tweezers Nozzle

MSX500 X Ray Inspection System	ST50K Sensor Kit

	OP-TB01 Test Board Kit

	Board prevention Jig