Nozzle: It selects according to the size of the package which rework. Sensor Kit : This is CA sensor for surface temperature of the package and also the board. Cleaning unit : It is the cleaner for the board which after reworking. Solder Printing Jig : The printing jig for the BGA. Test Board Kit :It is for Vision system calibration. Inspection system : X ray inspection system for after reworking.